Major imaging manufacturer implements plasma dicing
ST. PETERSBURG, Fla. (Feb. 12, 2016) — Plasma-Therm has received another order for its leading plasma die-singulation system, the Singulator® MDS-100™, from a multinational manufacturer of imaging and optical products.
The system will be the first Singulator® MDS-100™ to be installed in Japan. Since its introduction in 2013, Singulator® MDS-100™ systems have been installed in the United States, Europe and Asia.
Plasma-Therm’s Singulator® line comprises the MDS-300™ for wafers up to 300mm (12 inch) diameter, and the MDS-100™ for wafers up to 200mm (8 inch) diameter. Both Singulator® systems process silicon wafers on industry-standard tape frames, and are capable of processing multiple wafer sizes without any process chamber modifications.
Singulator® systems are now in production for a range of devices, including power chips, LEDs, RFID, and IR image sensors, and they are being tested for 3D MEMS, III-V semiconductor, and CMOS devices, according to Thierry Lazerand, Plasma-Therm’s director of business development marketing.
“This new order shows that industry leaders recognize the quality and ROI of the PDOT (Plasma Dicing On Tape) approach offered by Plasma-Therm, “ said Lazerand. “This is a crucial step, especially for high-tech manufacturing in Japan and for the image sensors and peripherals segment, where device packaging quality and performance are paramount for digital cameras and other products.”
Plasma singulation, also called “plasma dicing,” is an enabling technology for continued improvement in device performance and increasingly demanding specifications for advanced packaging, in particular for WLCSP (wafer-level chip-scale package). Faster, more power-efficient devices, and shrinking product sizes, are driving chip manufacturers to use thinner wafers, smaller dies, and advanced packaging techniques such as 2.5D and 3D die stacking. For those technologies, plasma dicing has significant advantages over mechanical sawing and laser ablation die singulation. Plasma-Therm Receives Singulator® Order, page 2 of 3 10050 16th St. N., St. Petersburg, Florida 33716 | (727) 577-4999 | www.plasmatherm.com
Plasma dicing eliminates chipping and cracking caused by sawing, and avoids redeposited material from laser ablation. Plasma dicing produces stronger dies with reduced stress at corners. Plasma dicing also frees up valuable wafer area, because dies do not have to be placed on a strict grid, and plasma is compatible with non-rectangular die shapes. In addition, Plasma dicing increases throughput because entire wafers are singulated at once.
Founded in 1975, Plasma-Therm is U.S.-based manufacturer of etch, deposition, and die-singulation systems for specialty semiconductor markets, including solid-state lighting, power, data storage, renewable energy, MEMS, photonics, wireless, photomask, and advanced packaging. Plasma-Therm’s outstanding products and customer service have been recognized for 17 years with awards in the VLSIresearch Customer Satisfaction Survey. Sales and service locations throughout North America, Europe, and Asia Pacific meet the diverse needs of Plasma-Therm’s global customer base. More information is available at www.plasmatherm.com.