Plasma dicing system gaining acceptance for increasing yields, with low cost of ownership for high-volume production
- PETERSBURG, FLORIDA (July 8, 2015) — A global LED manufacturer has placed an order for a Plasma- Therm Singulator™ plasma dicing system to be used in high-volume LED production, the company has announced.
The manufacturer produces LEDs for residential, commercial and automotive lighting, and placed the order for a Plasma-Therm MDS-100 MicroDie Singulator™ after extensive testing and qualification, according to Jim Pollock, executive vice president of sales and service for Plasma-Therm.
“We demonstrated that plasma singulation is better, faster, and very cost-effective for LED production,” Pollock said. “We anticipate more orders from this customer and from other manufacturers in the near future as market forces drive plasma dicing into the mainstream.”
Plasma dicing has multiple advantages over sawing and laser ablation, Pollock said, including speed, minimum street width, chip integrity, elimination of chipping and cracking, and higher die strength. Also, plasma dicing enables dies with rounded corners and non-orthogonal shapes.
“Plasma singulation is a revolutionary development that enables greater manufacturing efficiencies,” said Thierry Lazerand, director of business development for Plasma-Therm. He explains that plasma dicing allows streets to be reduced from 90 microns wide to less than 10 microns, which increases die yield by 15 percent per wafer.
This is the third MDS-100 ordered for volume production use, with a fourth system ordered recently by a global sensor and imaging company. MDS-100 systems perform plasma dicing of wafers up to 200mm on industry-standard tape frames. The systems accommodate up to three process modules with cassette-to-cassette material handling. Systems are also available with manual load-lock modules for R&D and pilot production applications.
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Manufacturer Orders Singulator™ System, page 2 of 2
Plasma-Therm’s Plasma Singulator™ technology, developed in partnership with On Semiconductor, was introduced in November 2013 with the launch of the MDS-100 MicroDie Singulator™ system. Plasma- Therm and On Semiconductor have a cross-licensing agreement for patented technology used in Singulator™ systems. Plasma-Therm has secured U.S. patents for several aspects of Singulator™ technology and additional U.S. and foreign patents are pending.
Plasma-Therm is a U.S.-based manufacturer of advanced plasma processing equipment for specialty semiconductor markets, including solid-state lighting, power, data storage, renewable energy, MEMS, nanotechnology, photonics, wireless communication, photomask, and semiconductor packaging. With leading etch and deposition technologies, Plasma-Therm has won awards for customer satisfaction for the last 16 years from VLSIresearch. Sales and service locations throughout North America, Europe, and Asia Pacific meet the needs of the company’s global customer base. More information is available at www.plasmatherm.com.