St. Petersburg, Florida, October 21, 2013 – A leading global semiconductor device manufacturer has placed a repeat order to expand its capacity for plasma dicing of thin wafers.
The equipment will be installed at an Asian location of this Integrated Device Manufacturer and will significantly increase the company’s die-singulation capacity. The MDS-100 system, the first of its kind, has been operating in the company’s production facility since late last year. This repeat order demonstrates the customer’s confidence in the performance of this system.
Plasma-Therm’s MDS-100 MicroDieSingulator, formally introduced in October this year, is the first system used in volume production to provide plasma-based dicing of integrated-circuit dies. MDS systems create streets (separation lines) of only 15 microns or less, compared to 70-micron-wide streets required by mechanical saws and lasers. Plasma dicing also has demonstrated faster and far more accurate results than saws and lasers, especially for thin wafers.
“This follow-on order clearly demonstrates the compelling quality and yield obtained with our technology, and is a clear indication of its readiness for large-scale production,” said Thierry Lazerand, Plasma-Therm’s director of technical marketing.
Established in 1974, Plasma-Therm is a U.S. manufacturer of advanced plasma processing equipment, focusing on research and development to high-volume production in specialty semiconductor markets, including solid-state lighting, power, data storage, renewable energy, MEMS, nanotechnology, photonics, and wireless communication. Plasma-Therm offers leading etching and deposition technologies and solutions for these markets. Sales and service locations throughout North America, Europe and Asia-Pacific meet the diverse needs of Plasma-Therm’s global customer base. Please visit www.plasmatherm.com for more information.